The most relevant and controversial topics related to 3D integration and system in packaging manufacturing as well as applications will be addressed during the 3D & Systems Summit in Dresden, 28-30 January 2019 . The summit offers: a brand new agenda, invited high-caliber speakers, exhibition area and unique networking and B2B Matchmaking opportunities.
Registration details are available online here.
TOP NOTCH AGENDA:
See the Speaker Lineup here. The program includes presentations by leading companies ASE, Intel, Amkor, Fraunhofer IZM, imec, Global Foundries, Qualcomm RFFE, STMicroelectronics, Osram, Deca Technologies, and many more!
Don´t miss the Keynotes!
Heterointegration – The Path to Future Complex Intelligent Systems
Professor Hubert Lakner, Director
Fraunhofer-Institute for Photonic Microsystems IPMS
Heterogeneous Integration – The Future of Packaging
Steffen Kroehnert, Senior Director Technology Development, Business Development Europe
Amkor Technology Holding B.V. Germany
Discover the Exhibitors here. You will find: leading companies, technologies, and people driving the future of 3D Integration design and manufacturing. ASE Group, Amkor Technology, Canon, Confovis, DISCO, FineTech, Fraunhofer IZM, FRT Metrology, Imec, LPKF, Optim Wafer Services, SPTS, XPERI, and many more.
Find more information on the conference website.